Silicon Box opens US$2-billion factory in Singapore

Silicon Box, a Singapore-based semiconductor integration startup, launched its US$2-billion advanced semiconductor manufacturing foundry to revolutionise the chip manufacturing sector, develop local capabilities, and boost the country’s position as a global hub for semiconductor manufacturing. 

Supported by the Singapore Economic Development Board (EDB), Silicon Box is also looking to upskill and employ up to 1,200 highly skilled people with computer science, engineering, and design backgrounds.

Han Byung Joon, co-founder and CEO of Silicon Box, said the 73,000-sqm new factory located in Tampines is well poised to solve the unique challenges for chiplet adoption, which is critical to meet market demands of emerging technologies. 

“Our proprietary interconnection technology will not only shorten the design cycle of chips but also lower new device costs, reduce power consumption and enable faster time-to-market for industry partners like artificial intelligence, data centres, and electronic vehicles” said Han. 

The establishment of this factory is poised to have a significant impact on Singapore’s semiconductor sector. It is expected to boost the industry’s growth and elevate the country’s standing in the global market. 

This development will contribute to the nation’s economic expansion and support Singapore’s long-term vision of expanding its manufacturing base.

With the support of the Singapore EDB, the factory will create over 1,000 technologically advanced jobs while providing upskilling opportunities. 

This venture focuses on human capital spanning from entry-level to highly skilled engineering roles; the homegrown talent is vested in Silicon Box’s vision as they commit to providing upskilling programs to keep the Singaporean workforce market-ready in disruptive technologies.

Silicon Box offers design flexibility and exceptional electrical performance at a lower cost and power consumption with its proprietary fabrication method. 

They have developed the shortest interconnections using sub-5-micron technology, setting a new standard in semiconductor design cycles. This means the industry can efficiently scale chiplet-based solutions across the semiconductor value chain.

Silicon Box’s one-of-a-kind fabrication method increases design flexibility, providing better electrical performance.

This promises cost-savings without compromising on power as Silicon Box delivers results at lower cost and power consumption.

There is also benefit from the shortest interconnections, engineered using advanced sub-5-micron technology, ensuring quicker scaling of chiplet-based solutions.

The method also leverage the advantages of chiplets that allow larger systems to be built economically with optimised power consumption and higher performance.

The benefits for chip designers result in double computing performance at a fraction of the cost compared to traditional approaches. 

For graphical processors and high-performance computing chips, costs can be reduced by up to four times. This is a new paradigm in the chip industry, where stakeholders can concentrate on enhancing the performance optimisation of these modular functional units.