TSMC is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing.
As chips move to more advanced nodes, bringing them from design to high-volume production has become one of the world’s most complex computing challenges.
Computational lithography, transistor simulation, process control and wafer inspection now require massive-scale simulation and real-time optimization, and AI systems that can provide support across physics, images and other applications.
TSMC is using NVIDIA technologies to accelerate this transformation, applying accelerated computing and AI across the semiconductor design and manufacturing lifecycle to improve turnaround time, energy efficiency, yield and operational productivity in advanced fabs.
Jensen Huang, founder and CEO of NVIDIA, said NVIDIA and TSMC have worked together for nearly three decades to push the limits of computing.
“TSMC is bringing NVIDIA AI and accelerated computing into the fab itself, tackling some of the world’s most complex design and manufacturing challenges with simulation, optimization and AI to improve speed, efficiency and yield for the next generation of chips,” said Huang.
C.C. Wei, chairman and CEO of TSMC, said that by using NVIDIA accelerated computing and AI across fab operations optimization, lithography, process control and inspection, TSMC is strengthening our technology leadership and manufacturing excellence to support our customers’ future products and success.
Advanced semiconductor design and manufacturing require massive computational workloads and highly coordinated fab operations, spanning chip-design transfer, transistor modeling, process control and fab productivity.
TSMC is using NVIDIA libraries and AI models to accelerate these workloads on NVIDIA GPUs, including those related to computational lithography; transistor, equipment and process simulation; advanced process control and; fab operations optimization.
Also, as chips become more advanced, even the smallest defects can affect quality and yield, making faster and more accurate inspection essential to semiconductor design and manufacturing.
TSMC is using NVIDIA’s platform and toolkit to improve advanced defect classification. Using vision AI, TSMC has improved detection of defects at nanometer scale.
These capabilities help TSMC improve quality inspection while reducing the need for repeated labeling and retraining as process conditions, inspection tools and defect types change.
